Opportunities Brought by New Energy Vehicle to the Surface Finishing Industry

Driven by the global "Dual Carbon" goal, the New Energy Vehicles (NEVs) industry is undergoing significant changes. With the large-scale application of lightweight materials such as high-strength steels and aluminum alloys as well as the continued growth of the global NEVs market demand, surface finishing technology is accelerating towards high corrosion resistance, intelligence and environmental friendliness. However, industry development still faces challenges, such as bottlenecks in the pre-treatment of multi-metallic materials and standards for anti-corrosion performance of automobile exports, etc. At the same time, innovative technologies such as A.I. testing, high-performance electrophoretic paints and phosphating and fluoridation processes are gradually breaking through the boundaries of industrial applications, thereby becoming key variables in the industry.

This Technical Forum will focus on the challenges of NEVs surface technology, bringing together automobile mainframes and parts manufacturers, surface finishing service providers, scientific research institutes, raw material suppliers and testing institutions, etc., to conduct in-depth discussions on cutting-edge technologies, thereby providing solutions and technological breakthroughs for the NEVs industry. Join us for FREE!

Date: 25 November, 2025 (Exhibition Day 1)

Time: 14:00 -16:00

Venue: Meeting Room M13 (Near Hall E1)

Language: Chinese (Putonhua)

Fee: Free of Charge

Registration: No registration required. Arrive at the venue 15 minutes before and provide your business card for entry.

Advanced Manufacturing & Technological Innovation: Future-Oriented Electronic (Chip) Electroplating Processes

Chip electroplating processes play a decisive role in chip's performance and reliability, while the research and development of next-generation semiconductor (electronic) materials is key to the future development of the industry. Looking to the future, opportunities and challenges coexist in electronic electroplating. Emerging industries such as 5G communications, A.I. and new energy vehicles are booming, opening up new market demands for the application of chip electroplating technology. Currently, these key areas still face severe challenges such as technical barriers and talent shortages. Scientific research will continue to play a bridging role to solve technical bottlenecks, achieve technological innovations and ensure high-quality development.

Experts from renowned companies in chip technology, scientific research technology, surface finishing processing industry, universities, etc., will participate in this Technical Forum to analyze the future development trend of "Chip Electroplating Technology". Join us for FREE!

Date: 26 November, 2025 (Exhibition Day 2)

Time: 10:30 -12:30

Venue: Meeting Room M13 (Near Hall E1)

Language: Chinese (Putonhua)

Fee: Free of Charge

Registration: No registration required. Arrive at the venue 15 minutes before and provide your business card for entry.

Time	Topic	Presenting Unit	Speaker	Job Title
10:30-11:00	Advanced Packaging Microbump Electroplating Technology	Shanghai Jiao Tong University	LI Ming	Professor
11:00-11:30	Electrodeposition Technologies and High-End Copper Foil Manufacturing Process	Jiangsu Mengde New Materials Technology Co., Ltd.	FANG HuiMing	CTO
11:30-12:00	Additives Application in Electrolytes for 3D Copper Interconnects	Shanghai Institute of Technology	WAN ChuanYun	Professor
12:00-12:30	Challenges in Electrodeposition Technologies for AI Chip Advanced Packaging	Shanghai SkyChem Technologies Co., Ltd. （Stock Code 688603）	Kevin HAN	Chief Technical Specialist