Smart Plating, Chip-Powered Future — Semiconductor and Electronic Plating Innovation Forum

Date: 11th November, 2026 (Day 1 of the Exhibition) Time: 14:00 -- 16:00 Venue: Meeting Room #3, Area A, China Import & Export Fair Complex (Opposite to Hall 4.1) Registration : Please arrive at the Meeting Room 15 minutes before the event begins, follow the staff's instruction to queue up, and provide your Business Card for entry

In the context of a new round of global technological upgrading, the convergence of Integrated Circuits (IC) and Artificial Intelligence (AI) has emerged as the core arena for strategic competition at the international frontier. Driven by the country's strategy for independent innovation in the semiconductor industry, the “Core-Strengthening Breakthrough Project” is making steady progress, aiming to secure a leading position in this cutting-edge field.

As an indispensable core process in silicon-based semiconductors, third-generation semiconductors, and advanced chip packaging integration, electronic electroplating directly determines chip yield and ultimate performance. Today, advanced semiconductor packaging is evolving rapidly, while AI is increasingly integrated into process R&D and production line management.

The Technology Forum converges on 2 pivotal tracks: Semiconductor Plating and AI, where the Organizer plans to bring together top experts, scholars, and industry leaders from universities, research institutes, and leading enterprises across the Guangdong-Hong Kong-Macao Greater Bay Area (GBA), aiming to build a high-level platform for exchange and collaboration. Join us in exploring new pathways for technological breakthroughs and industrial synergy. Admission is free — welcome to attend!